Talk:List of integrated circuit packaging types

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Untitled[edit]

This page no longer seems to be a stub. In addition, there are many references. As such I feel that removal of both the references needed and stub templates is in order. —Preceding unsigned comment added by Anon423 (talk • contribs) 02:29, 23 July 2010 (UTC)[reply]

References 2, 3, 4, 5, 6, 9, 11, 12, 13, 15, 16, 19 and 20 are dead, leaving only nine real links. 195.11.201.126 (talk) 11:01, 31 December 2014 (UTC)[reply]

Butterfly package for laser diodes[edit]

I don't find the butterfly package for laser diodes, this is an industry standard package but maybe I overlooked it in the list as it might go by another industry name? see e.g. http://www.thorlabs.de/NewGroupPage9.cfm?ObjectGroup_ID=1558 (the specs section) for the type of package I mean by Butterfly. Maybe put "Butterfly package" between brackets if it is already in the list? —Preceding unsigned comment added by 130.37.34.36 (talk) 08:20, 12 April 2011 (UTC)[reply]

Stress the acronyms or the full names?[edit]

When I cleaned up the list, I chose to stress the acronyms, because that is what you see most often in datasheets. Alternatively, you could have made the names be linkified and had the acronyms in parentheses after the links. That would be okay. Just make sure to be consistent. DavidGrayson (talk) 19:24, 2 March 2009 (UTC)[reply]

PAC[edit]

I don't see Pin Array Cartridge (PAC) in the list, which was the package used for the orginal Itanium (PAC418). See Eighth-Generation (64-Bit Register) Processors.

I added PAC using a reference with a better picture. Obankston (talk) 05:10, 14 March 2010 (UTC)[reply]

Merge article[edit]

Should this page be merged with List of electronics package dimensions? They seem to cover the same ground. -- Malvineous (talk) 04:02, 26 March 2010 (UTC)[reply]

I agree with Malvineous -- there's a lot of overlap between the two, so merging into a single article seems better. Done I also suggest merging the "Surface-mount technology#Packages" section into this list of integrated circuit packaging types, leaving behind a brief WP:SUMMARY. --DavidCary (talk) 18:41, 12 September 2013 (UTC) It seems like a lot of info to be used in one article. — Preceding unsigned comment added by 2601:404:C202:A576:404:7251:4AEF:2303 (talk) 01:03, 30 March 2016 (UTC)[reply]

"Chip carrier" is not the general name for an IC package[edit]

The industry seems to call only a few particular packages "chip carrier", not DIP , etc. packages. --Wtshymanski (talk) 22:41, 15 December 2011 (UTC)[reply]

The secret to an uncontroversial career on Wikipedia is to only edit parts-list articles that no-one cares about. --Wtshymanski (talk) 04:50, 22 December 2011 (UTC)[reply]

Merge information from Leadless chip carrier to this article[edit]

It has been proposed that information from the Leadless chip carrier be merged into this article. In this case, this would be a reasonable merge, as long as all pertinent information in the "Leadless chip carrier" article is merged verbatim. Northamerica1000(talk) 12:29, 31 December 2011 (UTC)[reply]

So be bold! I've had one shot at it, now it's your turn. --Wtshymanski (talk) 19:49, 31 December 2011 (UTC)[reply]

External links modified[edit]

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Images request[edit]

Hi all, I'm just getting into this subject for work. It would be really helpful to have pictures from each family of package types, if anyone can supply them?

Cheers Comrade jo (talk) 12:23, 19 April 2016 (UTC)[reply]


I think this is a great idea. Would it be worth adding another column to the table and inserting a small image inside?

Davidjessop (talk) 09:28, 26 November 2016 (UTC)[reply]

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DATE COLUMN IN CHART NEEDED[edit]

I think a date column needs to be added to the charts to show when the newer sizes and technologies came into existence and possibly when the older sizes were deprecated. I would think all of the "inch" sizes are obsolete and by now would be considered legacy. — Preceding unsigned comment added by Ametrica (talk • contribs) 13:13, 27 May 2018 (UTC)[reply]

Dimension reference[edit]

I think all dimension references should be changed. The reference symbol do not align with any package datasheet from manufacturers:

  • Pitch should be "e", not "P"
  • Width of terminal should be "b", not "LW".
  • Length of terminal should be "L", not "LL".
  • Thickness of terminal should be "c", not "T".
  • Overall width should be "E", not "WL".
  • Molded body width should be "E1", not "WB".
  • Overall width should be "D", not "L".
  • Clearance between body and seating plane should be "A1", not "C". It's not an important parameter and shouldn't be listed anyway.
  • The total height (from tip of terminals to top of the molded body) is not very important.
  • Instead, the distance between the seating plane and the top of molded body (which is "A") should be listed

Dan1wang (talk) 10:09, 8 March 2019 (UTC)[reply]

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