File:Integrated Passive Device solution versus Surface Mount Device (SMD) solution.png
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Summary
| Description |
English: Integrated Passive Devices offer design simplification by reducing the Bill of Material.
It offers high system integration and reliability improvement by decreasing the number of solder joins compare to discrete surface mount devices. Providing all kind of capacitor, inductor and resistor values can be designed and integrated, IPD devices using glas or High resistivity silicon substrate can provide improved RF performances. They can be used from 169MHz to above 60GHz. |
| Date | |
| Source | Own work |
| Author | STMicroelectronics |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 13:49, 26 May 2015 | | 867 × 337 (573 KB) | Richardrenard | Improved cropping for better resolution results |
| 13:39, 26 May 2015 |  | 872 × 349 (588 KB) | Richardrenard | User created page with UploadWizard |
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