File:BGA Package Sideview.svg

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Original file ‎(SVG file, nominally 728 × 390 pixels, file size: 16 KB)

Description
Deutsch: Kontaktierungsschema.
English: BGA with a interposer between the integrated circuit die to ball grid array.
日本語: BGA.
Svenska: BGA-kapsel i genomskärning.
Date (UTC)
Source
Author


This is a retouched picture, which means that it has been digitally altered from its original version. Modifications: Converted to SVG. The original can be viewed here: BGA package sideview.PNG: . Modifications made by Serenthia.

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Original upload log

This image is a derivative work of the following images:

  • File:BGA_package_sideview.PNG licensed with Cc-by-sa-3.0-migrated, GFDL
    • 2007-12-07T08:45:58Z Tosaka 740x470 (44144 Bytes) {{Information |Description= |Source=self-made |Date= |Author= [[User:Tosaka|Tosaka]] |Permission= |other_versions= }}

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inception

20 January 2011

media type

image/svg+xml

checksum

da72b64330a680df9ee7b8d0d60621b461674557

determination method: SHA-1

data size

16,362 byte

height

390 pixel

width

728 pixel

File history

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Date/TimeThumbnailDimensionsUserComment
current06:59, 2 April 2018Thumbnail for version as of 06:59, 2 April 2018728 × 390 (16 KB)Mikhail Ryazanovrm. excessive capitalization; text as text
04:44, 20 January 2011Thumbnail for version as of 04:44, 20 January 2011728 × 390 (57 KB)SerenthiaFixed stupid errors (legacy PNG on a layer, text not converted...)
04:42, 20 January 2011Thumbnail for version as of 04:42, 20 January 2011728 × 390 (16 KB)Serenthia{{Information |Description={{de|Kontaktierungsschema.}} {{en|BGA with a interposer between the integrated circuit die to ball grid array.}} {{ja|BGA.}} {{sv|BGA-kapsel i genomskärning.}} |Source=*File:BGA_package_sideview.PNG |Date=2011-01-20 04:42
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