File:Pad Cratering 02.jpg
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Summary
| Description |
English: Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and starting the pad to lift. Eventually creating pad cratering. |
| Date | |
| Source | Integral Technology, Lake Forest, CA |
| Author | Chris Hunrath |
Licensing
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The copyright holder of this file allows anyone to use it for any purpose, provided that the copyright holder is properly attributed. Redistribution, derivative work, commercial use, and all other use is permitted. |
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File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 00:43, 9 November 2010 | | 387 × 292 (10 KB) | Rockyh2 | {{Information |Description={{en|1=Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and starting the pad to lift. Eventually creating pad cratering.}} |Source=Integral Technology, Lake Forest, CA |Author=Chris Hunrath |Dat |
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