File:A silicon IC as tape automated bonded (TAB) on the 35mm tape. Upper picture shows IC front side as glob topped and lower picture backside of the IC.png
_on_the_35mm_tape._Upper_picture_shows_IC_front_side_as_glob_topped_and_lower_picture_backside_of_the_IC.png){kind=small}
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Summary
| Description |
English: A silicon IC as tape automated bonded (TAB) on the 35mm tape. Upper picture shows IC front side as glob topped and lower picture backside of the IC. |
| Date | |
| Source | Own work |
| Author | Khpsoi |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 08:29, 9 April 2021 | | 982 × 914 (1.5 MB) | Khpsoi | Uploaded own work with UploadWizard |
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_on_the_35mm_tape._Upper_picture_shows_IC_front_side_as_glob_topped_and_lower_picture_backside_of_the_IC.png){kind=link}